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august 2011 doc id 1461 rev 3 1/18 18 tda2050 32 w hi-fi audio power amplifier features high output power (50 w music power iec 268.3 rules) high operating supply voltage (50 v) single or split supply operations very low distortion short-circuit protection (out to gnd) thermal shutdown description the tda 2050 is a monolithic integrated circuit in a pentawatt package, intended for use as an audio class-ab audio amplifier. thanks to its high po wer capability the tda2050 is able to provide up to 35 w true rms power into a 4 ohm load at thd = 0%, v s = 18 v, f = 1 khz and up to 32 w into an 8 ohm load at thd = 10%, v s = 22 v, f = 1 khz. moreover, the tda2050 delivers typically 50 w music power into a 4 ohm load over 1 sec at v s = 22.5 v, f = 1 khz. the high power and very low harmonic and crossover distortion (thd = 0.05% typ, at v s = 22 v, p o = 0.1 to 15 w, r l = 8 ohm, f = 100 hz to 15 khz) make the device most suitable for both hi-fi and high-end tv sets. figure 1. test and application circuit table 1. device summary order code package tda2050v pentawatt vertical pentawatt v www.st.com
device overview tda2050 2/18 doc id 1461 rev 3 1 device overview table 2. absolute maximum ratings table 3. thermal data figure 2. pin connections (top view) figure 3. schematic diagram symbol parameter value unit v s supply voltage 25 v v i input voltage v s v i differential input voltage 15 v i o output peak current (internally limited) 5 a p tot power dissipation at t case = 75 c 25 w t stg , t j storage and junction temperature -40 to 150 c symbol parameter value unit r th j-case thermal resistance junction-case 3 (max) c
tda2050 device overview doc id 1461 rev 3 3/18 the values given in the following table refer to the test circuit v s = 18 v, t amb = 25 c, f = 1 khz, unless otherwise specified. table 4. electrical characteristics symbol parameter test conditions min. typ. max. unit v s supply voltage range 4.5 25 v i d quiescent drain current v s = 4.5 v s = 25 30 55 50 90 ma ma i b input bias current v s = 22 0.1 0.5 a v os input offset voltage v s = 22 15 mv i os input offset current 200 na p o output power d = 0.5%, r l = 4 r l = 8 v s = 22 v, r l = 8 24 22 28 18 25 w w w d = 10%, r l = 4 r l = 8 v s = 22 v, r l = 8 35 22 32 w w w music power iec268.3 rules d = 10%, t = 1s r l = 4 ; vs = 22.5 v 50 w d distortion p o = 0.1 to 24w, r l = 4 , f = 1 khz f = 100 to 10 khz, po = 0.1 to 18 w 0.03 0.5 0.5 % % vs = 22 v, r l = 8 , f = 1 khz, po = 0.1 to 20 w, f = 100 hz to 10 khz; p o = 0.1 to 15 w 0.02 0.5 % % sr slew rate 5 8 v/s g v voltage gain (open loop) f = 1 khz 80 db g v voltage gain (closed loop) f = 1 khz 30 30.5 31 db bw power bandwidth (-3db) v i = 200 mw, r l = 4 ; 20 to 80.000 hz e n input noise voltage b = curve a b = 22 hz to 22 khz 4 510 v v r i input resistance (pin 1) 500 k svr supply voltage rejection r g = 22 k , f = 100 hz; v ripple = 0.5 v rms 45 db h efficiency p o = 28 w, r l = 4 65 % p o = 25 w, r l = 8 , v s = 22 v, 67 % t sd-j thermal shutdown junction temperature 150 c
device overview tda2050 4/18 doc id 1461 rev 3 figure 4. split-supply typical application circuit figure 5. pc board and component layout of split-supply typical application circuit r3 r2 r1 c2 c4 c3 r4 c5 c6 c1 c7 +vs r l -vs tda2050 vi
tda2050 split-supply application suggestions doc id 1461 rev 3 5/18 2 split-supply application suggestions the recommended values of the external components are those shown on the application circuit of figure 5 . different values can be used. the following table can help the designer. table 5. recommended values of external components component recommended value purpose larger than recommended value smaller than recommended value r1 22 k input impedance increase of input impedance decrease of input impedance r2 680 feedback resistor decrease of gain (1) 1. the gain must be higher than 24 db increase of gain r3 22 k increase of gain decrease of gain (1) r4 2.2 frequency stability danger of oscillations c1 1 f input decoupling dc higher low-frequency cutoff c2 22 f inverting input dc decoupling increase of switch on/off noise higher low-frequency cutoff c3, c4 100 nf supply voltage bypass danger of oscillation c5, c6 220 f supply voltage bypass danger of oscillation c7 0.47 f frequency stability danger of oscillation
split-supply application suggestions tda2050 6/18 doc id 1461 rev 3 2.1 printed circuit board the layout shown in figure 5 should be adopted by the designers. if different layouts are used, the ground points of input 1 and input 2 must be well decoupled from the ground return of the output in which a high current flows. figure 6. single-supply typical application circuit figure 7. pc board and component layout of single-supply typical application circuit
tda2050 single-supply application suggestions doc id 1461 rev 3 7/18 3 single-supply application suggestions the recommended values of the external components are those shown in the application circuit of figure 6 . different values can be used. the following table can help the designer. table 6. recommonded values note: if the supply voltage is lower than 40 v and the load is 8 ohm (or more), a lower value of c2 can be used (i.e. 22 mf). c7 can be larger than 1000 f only if the supply voltage does not exceed 40 v. component recommended value purpose larger than recommended value smaller than recommended value r1, r2, r3 22 k biasing resistor r4 680 feedback resistor increase of gain decrease of gain (1) 1. the gain must be higher than 24 db r5 22 k decrease of gain (1) increase of gain r6 2.2 frequency stability danger of oscillations c1 2.2 f input decoupling dc higher low-frequency cutoff c2 100 f supply voltage rejection worse turn-off transient worse turn-on delay c3 1000 f supply voltage bypass danger of oscillations worse turn-off transient c4 22 f inverting input dc decoupling increase of switching on/off higher low-frequency cutoff c5 100 nf supply voltage bypass danger of oscillations c6 0.47 f frequency stability danger of oscillations c7 1000 f output dc decoupling higher low-frequency cutoff
typical characteristics (split-supply test circuit unless otherwise specified) tda2050 8/18 doc id 1461 rev 3 4 typical characteristics (split-supply test circuit unless otherwise specified) figure 8. output power vs. supply voltage figure 9. distortion vs. output power figure 10. output power vs. supply voltage figure 11. distortion vs. output power
tda2050 typical characteristics (split-supply test circuit unless otherwise specified) doc id 1461 rev 3 9/18 figure 12. distortion vs. frequency f igure 13. distortion vs. frequency figure 14. quiescent current vs. supply voltage figure 15. supply voltage rejection vs. frequency
typical characteristics (split-supply test circuit unless otherwise specified) tda2050 10/18 doc id 1461 rev 3 figure 16. supply voltage rejection vs. frequency (single-supply) for different values of c2 ( figure 6 ) figure 17. supply voltage rejection vs. frequency (single-supply) for different values of c2 ( figure 6 ) figure 18. total power dissipation and efficiency vs. output power figure 19. total power dissipation and efficiency vs. output power
tda2050 short-circuit protection doc id 1461 rev 3 11/18 5 short-circuit protection the tda2050 has an original circuit which limits the current of the output transistors. the maximum output current is a function of the collector emitter voltage, hence the output transistors work within their safe operating area. this function can therefore be considered as being peak power limiting rather than simp le current limiting. it reduces the possibility that the device gets damaged during an accidental short-circuit from ac output to ground.
thermal shutdown tda2050 12/18 doc id 1461 rev 3 6 thermal shutdown the presence of a thermal limiting circuit offers the following advantages: 1. an overload on the output (even if it is permanent), or an above-limit ambient temperature can be easily tolerated since tj cannot be higher than 150 c. 2. the heatsink can have a smaller factor of safety compared with that of a conventional circuit. there is no possibility of device damage due to high junction temperature. if for any reason, the junction temperature increases up to 150 c, the thermal shutdown simply reduces the power dissipation and the current consumption. the maximum allowable power dissipation depends upon the thermal resistance junction- ambient. figure 20 shows this dissipable power as a function of ambient temperature for different thermal resistances. figure 20. maximum allowable power dissipation vs. ambient temperature 6.1 mounting instructions the power dissipated in the circuit must be removed by adding an external heatsink. thanks to the pentawatt package, the heatsink mounting operation is very simple, a screw or a compression spring (clip) being sufficient. between the heatsink and the package it is better to insert a layer of silicon grease, to optimize the thermal contact; no electrical isolation is needed between the two surfaces. figure 21 shows an example of a heatsink.
tda2050 thermal shutdown doc id 1461 rev 3 13/18 6.2 dimension recommendations the following table shows the length that the heatsink in figure 21 must have for several values of p tot and r th . table 7. dimension recommendations figure 21. example of heatsink p tot (w) 12 8 6 length of heatsink (mm) 60 40 30 r th of heatsink (c/w) 4.2 6.2 8.3
tda2050 14/18 doc id 1461 rev 3 appendix a a.1 music power concept music power is (according to the iec clauses n.268-3 of jan. 83) the maximum power which the amplifier is capable of producing across the rated load resistance (regardless of non- linearity) 1 sec after the application of a sinusoidal input signal of frequency 1 khz. according to this definition our method of measurement comprises the following steps: set the voltage supply at the maximum operating value apply a input signal in the form of a 1 khz tone burst of 1 sec duration: the repetition period of the signal pulses is 60 sec the output voltage is measured 1 sec from the start of the pulse increase the input voltage until the output signal shows a thd=10% the music power is then v 2 out /r l , where v out is the output voltage measured in the condition of point 4 and r l is the rated load impedance the target of this method is to avoid excessive dissipation in the amplifier. a.2 instantaneous power another power measurement (maximum instantaneous output power) was proposed by the iec in 1988 (iec publication 268-3 subclause 19.a). we give here only a brief extract of the concept, and a circuit useful for the measurement. the supply voltage is set at the maximum operating value. the test signal consists of a sinusoidal sign al whose frequency is 20 hz, to which are added alternate positive and negative pulses of 50 s duration and 500 hz repetition rate. the amplitude of the 20 hz signal is chosen to drive the amplifier to its voltage clipping limits, while the amplitude of the pulses takes the amplifier alternately into its current-overload limits. a circuit for generating the test signal is given in figure 22 . the load network consists of a 40 f capacitor, in series with a 1 ohm resistor. the capacitor limits the current due to the 20 hz signal to a low value, whereas for the short pulses the effective load impedance is of the order of 1 ohm, and a high output current is produced. using this signal and load network the measurement may be made without causing excessive dissipation in the amplifier. the dissipation in the 1 ohm resistor is much lower than a rated output power of the amplifier, because the duty-cycle of the high output current is low. by feeding the amplif ier output voltage to the xplate s of an oscilloscope, and the voltage across the 1 ohm resistor (representing the output current) to the y=plates, it is possible to read on the display the value of the maximum instantaneous output power. the result of this test applied on the tda2050 is: peak power = 100 w typ
tda2050 doc id 1461 rev 3 15/18 figure 22. test circuit for peak power measurement
package mechanical data tda2050 16/18 doc id 1461 rev 3 7 package mechanical data figure 23. pentawatt v package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. outline and mechanical data dim. mm inch min. typ. max. min. typ. max. a 4.80 0.188 c 1.37 0.054 d 2.40 2.80 0.094 0.11 d1 1.20 1.35 0.047 0.053 e 0.35 0.55 0.014 0.022 e1 0.76 1.19 0.030 0.047 f 0.80 1.05 0.031 0.041 f1 1.00 1.40 0.039 0.055 g 3.20 3.40 3.60 0.126 0.134 0.142 g1 6.60 6.80 7.00 0.260 0.267 0.275 h2 10.40 0.41 h3 10.40 0.409 l 17.55 17.85 18.15 0.691 0.703 0.715 l1 15.55 15.75 15.95 0.612 0.620 0.628 l2 21.2 21.4 21.6 0.831 0.843 0.850 l3 22.3 22.5 22.7 0.878 0.886 0.894 l4 1.29 0.051 l5 2.60 3.00 0.102 0.118 l6 15.10 15.80 0.594 0.622 l7 6.00 6.60 0.236 0.260 l9 2.10 2.70 0.083 0.106 l10 4.30 4.80 0.170 0.189 m 4.23 4.5 4.75 0.167 0.178 0.187 m1 3.75 4.0 4.25 0.148 0.157 0.187 v4 40 (typ.) v5 90 (typ.) dia 3.65 3.85 0.143 0.151 pentawatt v 0015981 f l l1 a c l5 d1 l2 l3 e m1 m d h3 dia. l7 l9 l10 l6 f1 h2 f gg1 e1 f e v4 resin between leads h2 v5 v4 pentvme l4 weight: 2.00gr
tda2050 revision history doc id 1461 rev 3 17/18 8 revision history table 8. document revision history date revision changes 31-aug-2011 3 removed minimum value from pentawatt (vertical) package dimension h3 in figure 23: pentawatt v package revised general presentation, minor textual updates
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